Inductor array chip and board having the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsSoo Hwan SON, Yu Jin CHOI, Ho Yoon KIM
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Abstract
There are provided an inductor array chip and a board having the same. The inductor array chip includes: a body in which a plurality of magnetic layers are stacked; first and second coil parts having a plurality of conductive patterns and a plurality of conductive vias formed in the plurality of magnetic layers; and first to fourth external electrodes disposed on outer surfaces of the body to be connected to both ends of the first and second coil parts, wherein the first and second coil parts are disposed in a thickness direction of the body and are separated from each other by a gap layer disposed therebetween.
Claims18
An inductor array chip comprising:
- a body in which a plurality of magnetic layers are stacked;
- first and second coil parts having a plurality of conductive patterns and a plurality of conductive vias disposed in the plurality of magnetic layers;
- and
- first to fourth external electrodes disposed on outer surfaces of the body to be connected to both ends of the first and second coil parts,
- wherein the first and second coil parts are disposed in a thickness direction of the body and are separated from each other by a gap layer disposed therebetween.
A board having an inductor array chip, the board comprising:
- a printed circuit board on which a plurality of electrode pads are provided;
- and
- an inductor array chip mounted on the printed circuit board,
- wherein the inductor array chip includes a body in which a plurality of magnetic layers are stacked, first and second coil parts having a plurality of conductive patterns and a plurality of conductive vias provided in the plurality of magnetic layers, and first to fourth external electrodes disposed on outer surfaces of the body to be connected to both ends of the first and second coil parts, and
- the first and second coil parts are disposed in a thickness direction of the body and are separated from each other by a gap layer disposed therebetween.
Dependencies are inferred from the claim text.