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US 2016/0078980 A1Published application
Copper bond wire and method of making the same
AssigneeHeraeus Materials Singapore Pte. Ltd.
InventorsMurali SARANGAPANI, Ping Ha YEUNG, Eugen MILKE
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Abstract
The invention is related to a bonding wire containing a core having a surface. The core contains copper as a main component, an average size of crystal grains in the core is between 2.5 μm and 30 μm, and a yield strength of the bonding wire is less than 120 MPa.
Claims21
-20. (canceled)
A bonding wire comprising a core having a surface, wherein the core comprises copper as a main component, an average size of crystal grains in the core is between 2.5 μm and 30 μm, and wherein a yield strength of the bonding wire is less than 120 MPa.
Dependencies are inferred from the claim text.