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AssigneeAsahi Glass Company, Limited
InventorsTomoya HOSODA, Yasuhiko MATSUOKA, Toru SASAKI, Wataru KASAI
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To provide an insulating tape for covering, in which a polyimide film and a fluorinated resin film are laminated with excellent adhesion, and a method for producing a structure, which comprises covering a conductor with such an insulating tape for covering, followed by thermal treatment. The insulating tape for covering, comprises a polyimide film and a fluorinated resin film directly laminated on one or both surfaces of the polyimide film, wherein the fluorinated resin film contains a fluorinated copolymer (A) which has a melting point of from 220 to 320° C. and can be melt-molded and which has at least one type of functional groups selected from the group consisting of carbonyl group-containing groups, hydroxy groups, epoxy groups and isocyanate groups.
An insulating tape for covering, which comprises a polyimide film and a fluorinated resin film directly laminated on one or both surfaces of the polyimide film, wherein the fluorinated resin film contains a fluorinated copolymer (A) which has a melting point of from 220 to 320° C. and can be melt-molded and which has at least one type of functional groups selected from the group consisting of carbonyl group-containing groups, hydroxy groups, epoxy groups and isocyanate groups.
A method for producing a structure, which comprises a step of covering the surface of a conductor with a tape-form fluorinated resin film to form a first covering layer, a step of covering the surface of the first covering layer with a tape-form polyimide film to form a second covering layer, and a step of thermally treating the conductor covered with the first and second covering layers to obtain a structure, wherein the fluorinated resin film contains a fluorinated copolymer (A) which has at least one type of functional groups selected from the group consisting of carbonyl group-containing groups, hydroxy groups, epoxy groups and isocyanate groups and which has a melting point of from 220 to 320° C. and can be melt-molded, and the thermal treatment is conducted at a temperature of at least the melting point of the fluorinated copolymer (A).
A method for producing a structure, which comprises a step of covering the surface of a conductor with a tape-form fluorinated resin film to form a first covering layer, a step of covering the surface of the first covering layer with a tape-form polyimide film to form a second covering layer, a step of covering the surface of the second covering layer with a tape-form fluorinated resin film to form a third covering layer, and a step of thermally treating the conductor covered with the first, second and third covering layers to obtain a structure, wherein each of the fluorinated resin films forming the first and third covering layers contains a fluorinated copolymer (A) which has at least one type of functional groups selected from the group consisting of carbonyl group-containing groups, hydroxy groups, epoxy groups and isocyanate groups and which has a melting point of from 220 to 320° C. and can be melt-molded, and the thermal treatment is conducted at a temperature of at least the melting point of the fluorinated copolymer (A).
Dependencies are inferred from the claim text.