Semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorsItaru Yamaguchi, Masaru Koyanagi, Hiroaki Nakano
Life of this patent
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Abstract
According to one embodiment, electrodes are provided in stacked M (M is an integer of 2 or more) semiconductor chips, a transmission units are provided for the semiconductor chips and, based on a chip identification information on a semiconductor chip in the present stage, transmits the chip identification information on a semiconductor chip in the next stage via the electrodes, or transmit a data for setting the chip identification information, and the direction in which an external signal is sent via the electrodes is opposite to the direction in which the chip identification information is transmitted via the electrodes.
Claims20
A semiconductor device, comprising:
- stacked M (M is an integer of 2 or more) semiconductor chips;
- electrodes that are provided in the semiconductor chips to connect electrically the semiconductor chips in the direction of stacking;
- and
- transmission units that are provided for the semiconductor chips and, based on a chip identification information on a semiconductor chip in the present stage, transmit the chip identification information on a semiconductor chip in the next stage via the electrodes, or transmit a data for setting the chip identification information, wherein
- the direction in which an external signal is sent via the electrodes is opposite to the direction in which the chip identification information is transmitted via the electrodes.
A semiconductor device, comprising:
- stacked M (M is an integer of 2 or more) semiconductor chips;
- electrodes that are provided in the semiconductor chips to connect electrically the semiconductor chips in the direction of stacking;
- and
- setting units that are provided for the semiconductor chips and set a chip identification information on a semiconductor chip in the present stage based on the chip identification information on the semiconductor chip in the previous stage, after resetting the chip identification information on the semiconductor chip in the present stage when the semiconductor chip is powered on, wherein
- the setting units set the chip identification information on the semiconductor chip after resetting as the chip identification information on the semiconductor chip in the present stage when the chip identification information on the semiconductor chip in the previous stage is not set.
A semiconductor device, comprising:
- stacked M (M is an integer of 2 or more) semiconductor chips;
- electrodes that are provided in the semiconductor chips to connect electrically the semiconductor chips in the direction of stacking;
- setting units that are provided for the semiconductor chips and set a chip identification information on a semiconductor chip in the present stage based on the chip identification information on the semiconductor chip in the previous stage, after resetting the chip identification information on the semiconductor chip in the present stage when the semiconductor chip is powered on;
- and
- controller connecting electrically to the semiconductor chips in series, wherein
- one of the setting unit of the one of the semiconductor chip, which is the nearest to the controller, sets the chip identification information on the semiconductor chip when the semiconductor chips are powered on, and
- another one of the setting unit of the another one of the semiconductor chip, which is the second nearest to the controller, sets the chip identification on the semiconductor chip after one of the setting unit setting.
Dependencies are inferred from the claim text.