Systems and methods for analyzing a bondline
AssigneeThe Boeing Company
InventorsGary E. Georgeson, Anish Poudel, Tsuchin Chu, James A. Grossnickle
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AssigneeThe Boeing Company
InventorsGary E. Georgeson, Anish Poudel, Tsuchin Chu, James A. Grossnickle
Estimating the term…
A method for analyzing a bondline in a structure is provided. The method includes obtaining, from a first side of the structure, by at least one computing device, at least one first internal image of the structure that includes at least a first pattern associated with the bondline, wherein the structure is in a pre-loaded state and obtaining, from the first side of the structure, by the at least one computing device, at least one second internal image of the structure that includes at least the first pattern, wherein the structure is in a loaded state. Additionally, the method includes comparing, by the at least one computing device, the at least one first internal image with the at least one second internal image, and determining, by the at least one computing device, at least one stress and/or strain-related property of the bondline based on the comparison. The method additionally includes predicting an estimated life of the bondline, whereby the estimated life provides a valuable tool for optimization of maintenance effort and enabling cost-optimal maintenance decisions.
A method for analyzing a bondline in a structure, the method is implemented by at least one computing device, the method comprising:
A computing device for use in analyzing a bondline in a structure, said computing device configured to:
A computer-readable storage medium having computer-executable instructions embodied thereon for configuring a computing device to analyze a bondline in a structure, wherein when executed by the computing device, the computer-executable instructions cause the computing device to:
The computer-readable storage medium of claim 19, wherein said computer-executable instructions additionally cause the computing device to determine a respective stress and/or strain-related property associated with each of a plurality of locations along the bondline.
Dependencies are inferred from the claim text.