Radiation Sensor, and its Application in a Charged-Particle Microscope
AssigneeFEI Company
InventorsGerard Nicolaas Anne van Veen, Cornelis Sander Kooijman, Luc Roger Simonne Haspeslagh
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Abstract
A pixelated CMOS radiation sensor (e.g. in a 4T pinned photodiode device) that comprises a layered structure including: A p-type Si substrate; An n-doped region within said substrate; A p+-doped pinning layer that overlies said n-doped region; An SiOx layer that overlies said p+-doped pinning layer and serves as a Pre-Metal Dielectric or Inter-Metal Dielectric layer, in which a Boron film is deposited between said p+-doped pinning layer and said SiOx layer. Application of such a (pure) Boron film serves to reduce leakage current by one or more orders of magnitude. Even a relatively thin Boron film (e.g. thickness 1-2 nm) can produce this effect.
Claims20
A pixelated CMOS radiation sensor that comprises a layered structure including:
- a p-type Si substrate;
- an n-doped region within said substrate;
- a p+-doped pinning layer that overlies said n-doped region;
- an SiOx layer that overlies said p+-doped pinning layer and serves as a Pre-Metal Dielectric or Inter-Metal Dielectric layer,
- in which a Boron film is deposited between said p+-doped pinning layer and said SiOx layer.
Dependencies are inferred from the claim text.