Bonded member and method for producing the same
AssigneeAlps Electric Co., Ltd.
InventorYoshinao Taniguchi
Life of this patent
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Abstract
A microchip plate according to an embodiment includes a first substrate, a second substrate, and an adhesive layer, the first substrate and the second substrate being bonded to each other with the adhesive layer provided therebetween, in which each of the first substrate and the second substrate is composed of a cycloolefin polymer (COP) or a cycloolefin copolymer (COC), and the adhesive layer contains a polymer of α-olefin.
Claims17
A bonded member comprising:
- a first substrate;
- a second substrate;
- and
- an adhesive layer, the first substrate and the second substrate being bonded to each other with the adhesive layer provided therebetween,
- wherein each of the first substrate and the second substrate is composed of a cycloolefin polymer (COP) or a cycloolefin copolymer (COC), and
- the adhesive layer contains a polymer of α-olefin.
A method for producing a bonded member including a first substrate, a second substrate, and an adhesive layer, the first substrate and the second substrate being bonded to each other with the adhesive layer provided therebetween, the method comprising:
- applying an adhesive containing α-olefin and a polymerization initiator to at least one of a facing surface of the first substrate and a facing surface of the second substrate, each of the first substrate and the second substrate being composed of a cycloolefin polymer (COP) or a cycloolefin copolymer (COC);
- and
- bonding the first substrate and the second substrate with the adhesive while the facing surface of the first substrate and the facing surface of the second substrate are allowed to face each other with the adhesive provided therebetween.
Dependencies are inferred from the claim text.