Soldering device, soldering method, and substrate and electronic component produced by the soldering device or the soldering method

A soldering method, comprising:

• a first treatment process, in which a component having an electrode to be soldered, is set;
• a second treatment process that is separated in a sealable manner by a first opening-closing controller, which is provided between a processor performing the first treatment process and a processor performing the second treatment process, and that sends out the component, which is fed from the portion performing the first treatment process, to the subsequent treatment process;
• a third treatment process that is separated in a sealable manner by a second opening-closing controller, which is provided between the processor performing the second treatment process and a processor performing the third treatment process, and that causes the component, which is fed from the processor performing the second treatment process, to make contact with an organic fatty acid-containing solution, and that moves the component horizontally;
• a fourth treatment process that moves the component, which has been moved horizontally in the third treatment process, to an upper space portion, that causes the molten solder to be adhered to the electrode, and that removes excessive molten solder out of the molten solder adhered in the space portion;
• a fifth treatment process that moves the component horizontally, which has been moved downward in the fourth treatment process;
• a sixth treatment process that is separated in a sealable manner by a third opening-closing controller, which is provided between a processor performing the fifth treatment process and a processor performing the sixth treatment process, and that sends out the component, which is fed from the processor performing the fifth treatment process, to the subsequent treatment process;
• and
• a seventh treatment process that is separated in a sealable manner by a fourth opening-closing controller, which is provided between the processor performing the sixth treatment process and a processor performing the seventh treatment process, and that takes out the component, which is fed from the processor performing the sixth treatment process.