Sealant composition and sealing sheet obtained from the composition
AssigneeFurukawa Electric Co., Ltd.
InventorsMasami AOYAMA, Tetsuya MIEDA, Keiji SAITO, Kunihiko ISHIGURO, Toshimitsu NAKAMURA, Naoaki MIHARA, Takumi ASANUMA
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Abstract
A sealant composition being adhesive for used in electronic devices, the sealant composition including an olefin-based polymer and a tackifier, wherein the olefin-based polymer is at least one selected from an ethylene/α-olefin copolymer and an ethylene/α-olefin/non-conjugated diene copolymer, and the content of the tackifier is 10% by mass or more and 70% by mass or less in the resin composition that constitutes the sealant composition.
Claims14
A sealant composition being adhesive for used in electronic devices, the sealant composition comprising an olefin-based polymer and a tackifier, wherein the olefin-based polymer is at least one selected from an ethylene/α-olefin copolymer and an ethylene/α-olefin/non-conjugated diene copolymer, and the content of the tackifier is 10% by mass or more and 70% by mass or less in the resin composition that constitutes the sealant composition.
A sealant composition having adhesiveness for used in electronic devices, the sealant composition comprising an olefin-based polymer and a tackifier, wherein the olefin-based polymer is at least one selected from an ethylene/α-olefin copolymer and an ethylene/α-olefin/non-conjugated diene copolymer, and the content of the tackifier is 40% by mass or more and 70% by mass or less in the resin composition that constitutes the sealant composition.
Dependencies are inferred from the claim text.