Multi-layered structure and method
AssigneeHeraeus Precious Metals GmbH & Co. KG
InventorsJami A. Hafiz, Stefan Schibli, Jens Troetzschel
Life of this patent
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Abstract
One aspect relates to a method for producing a layered structure, including providing a substrate, forming a first layer onto at least part of the substrate, the first layer being a first polymer, and forming a second layer onto at least part of the first layer, the second layer being a second polymer. The substrate and the second layer are electrically conductive and the first layer is insulating or the substrate and the second layer are insulating and the first layer is electrically conductive. Forming each of the first and second layers includes forming such that each layer is no more than one tenth of the thickness of the substrate.
Claims20
A method for producing a layered structure comprising:
- providing a substrate;
- forming a first layer onto at least part of the substrate, the first layer being a first polymer;
- forming a second layer onto at least part of the first layer, the second layer being a second polymer;
- wherein the substrate and the second layer are electrically conductive and the first layer is insulating or the substrate and the second layer are insulating and the first layer is electrically conductive;
- and
- characterized in that forming each of the first and second layers comprises forming such that each of the first and second layers is no more than one tenth of the thickness of the substrate.
A layered structure comprising:
- a substrate;
- a first layer over the substrate;
- and
- a second layer over the first layer;
- characterized in that the substrate and the second layer are an electrically conductive material and the first layer is an insulating material or the substrate and the second layer are insulating material and the first layer is electrically conductive material, and that at least one of the first and second layers comprises an electrically conductive polymer.
A layered structure comprising:
- a conductive substrate;
- a first layer over the substrate, wherein the first layer comprises an insulating material and includes at least one access area;
- and
- a contact area at least partially within the access area and in conductive contact with the substrate;
- characterized in that the first layer has a thickness that is no more than one tenth of the thickness of the substrate.
Dependencies are inferred from the claim text.