# US 2015/0375996 A1 · Method of making a system-in-package device, and a system-in-package device

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- Number: US 2015/0375996 A1
- Document ID: US20150375996A1
- Status: Published application
- Kind: A1
- Application number: 14/845,926
- Filed: 2015-09-04
- Published: 2015-12-31
- Earliest claimed: 2011-06-30
- Assignees: Murata Electronics Oy
- Applicants: Murata Electronics Oy
- Inventors: Heikki KUISMA
- Web page: https://patentgrep.com/patent/US20150375996A1

## CPC

- B81B 7/0074: {3D packaging, i.e. encapsulation containing one or several MEMS devices arranged in planes non-parallel to the mounting board}
- B81C 1/00333: {Aspects relating to packaging of MEMS devices, not covered by groups B81C1/00269 - B81C1/00325}
- G01C 19/5783: Mountings or housings not specific to any of the devices covered by groups G01C19/5607 - G01C19/5719
- G01L 19/148: {Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation}
- G01P 1/023: {for acceleration measuring devices}
- G01P 1/026: {for speed measuring devices, e.g. pulse generator}
- G01P 15/0802: {Details}
- H10W 20/43: Layouts of interconnections
- H10W 70/09: extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs
- H10W 70/614: {the multiple chips being integrally enclosed}
- H10W 72/0198: {batch processes}
- H10W 90/00: Package configurations
- B81B 2201/0235: Accelerometers
- B81B 2201/025: Inertial sensors not provided for in B81B2201/0235 - B81B2201/0242
- B81B 2201/0257: Microphones or microspeakers
- B81B 2201/0264: Pressure sensors
- B81B 2201/036: Micropumps
- B81B 2207/012: the micromechanical device and the control or processing electronics being separate parts in the same package
- B81B 2207/095: through the lid
- G01L 19/0084: {to the outside of the housing (other details about the housing see G01L19/14)}
- H10F 39/804: {Containers or encapsulations}
- H10W 44/248: {for antennas}
- H10W 72/072: {of bump connectors}
- H10W 72/07252: {changes in structures or sizes}
- H10W 72/073: {of die-attach connectors}
- H10W 72/07321: {Aligning}
- H10W 72/227: {Multiple bumps having different sizes}
- H10W 72/241: {Dispositions, e.g. layouts}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 74/019: {using temporary auxiliary substrates (H10W74/017 takes precedence)}
- H10W 74/142: {the encapsulations exposing the passive side of the semiconductor body}
- H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills
- H10W 90/722: {between stacked chips}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/732: {between stacked chips}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00)
- B81C: PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons B01J13/02; processes or apparatus specially adapted for the manufacture or treatment of piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/01)
- G01C: MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY (measuring liquid level G01F; radio navigation, determining distance or velocity by use of propagation effects, e.g. Doppler effects, propagation time, of radio waves, analogous arrangements using other waves G01S)
- G01L: MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE (weighing G01G)
- G01P: MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT (measuring or recording blood flow A61B5/02, A61B8/06; monitoring speed or deceleration of electrically-propelled vehicles B60L3/00; vehicle lighting systems adapted to indicate speed B60Q1/54; determining position or course in navigation, measuring ground distance in geodesy or surveying G01C; combined measuring devices for measuring two or more variables of movement G01C23/00; measuring velocity of sound G01H; measuring velocity of light G01J7/00; measuring direction or velocity of solid objects by reception or emission of radiowaves or other waves and based on propagation effects, e.g. Doppler effect, propagation time, direction of propagation, G01S; measuring speed of nuclear radiation G01T; measuring acceleration of gravity G01V; {measuring or recording the speed of trains B61L23/00; speed indicators incorporated in motor vehicles B60K35/00; measuring frequency or phase G01R; traffic control G08G})
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION

## Abstract

A method of making a system-in-package device, and a system-in-package device is disclosed. In the method, at least one first species die with predetermined dimensions, at least one second species die with predetermined dimensions, and at least one further component of the system-in-device is included in the system-in package device. At least one of the first and second species dies is selected for redimensioning, and material is added to at least one side of the selected die such that the added material and the selected die form a redimensioned die structure. A connecting layer is formed on the redimensioned die structure. The redimensioned die structure is dimensioned to allow mounting of the non-selected die and the at least one further component into contact with the redimensioned die structure via the connecting layer.

## Claims

### Claim 1

A system-in-package device, comprising
at least one first species die,
at least one second species die,
at least one further component of the system-in-package device;
at least one of the first and second species dies being included in a redimensioned die structure formed by solid material added to at least one side of the die;
a connecting layer on the redimensioned die structure;
a non-selected die and the at least one further component mounted in contact with the redimensioned die structure via the connecting layer.

### Claim 2 (depends on 1)

The system-in-package device according to claim 1, wherein:
dimensions of the first species die are determined by a first allotment of dies in a native first wafer;
dimensions of the second species die are determined by a second allotment of dies in a native second wafer.

### Claim 3 (depends on 1)

The system-in-package device according to claim 1, wherein the at least one further component of the system-in-device is a connection member for input and output operations of the system-in-package device.

### Claim 4 (depends on 1)

The system-in-package device according to claim 1, wherein the redimensioned die structure includes two or more dies.

### Claim 5 (depends on 1)

The system-in-package device according to claim 1, wherein two or more dies are in contact with the redimensioned die structure via the connecting layer.

### Claim 6 (depends on 1)

The system-in-package device according to claim 1, wherein the redimensioned die structure includes a die that provides a passage for fluids

### Claim 7 (depends on 1)

The system-in-package device according to claim 1, wherein the system-in package device includes a die that comprises at least one of the following elements: an optical element, a motion sensor, a pressure sensor a timing device, a filter device, an accelerometer, a magnetometer, a micro pump, and a microphone.

### Claim 8 (depends on 3)

The system-in-package device according to claim 3, wherein the connection member is connected to the connecting layer by means of a through-encapsulant via that extends through the redimensioned die structure.

### Claim 9 (depends on 1)

The system-in-package device according to claim 1, wherein the first species die or the second species die comprises at least one of the following elements: a MEMS device, an integrated semiconductor circuit, an ASIC circuit, oscillator, an optical device, an opto-electrical device, a magnetic device, a transducer, a sensor, a filter, switching board, wiring board, magnetostrictive element, electrostrictive element, piezoelectric device.