Clamping apparatus for cleaving a bonded wafer structure and methods for cleaving
AssigneeSunEdison Semiconductor Limited (UEN201334164H)
InventorsGregory A. Young, Jeffrey L. Libbert
Life of this patent
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Abstract
Apparatus and methods for mechanically cleaving a bonded wafer structure are disclosed. The apparatus and methods involve clamps that grip the bonded wafer structure and are actuated to cause the bonded structure to cleave.
Claims16
An apparatus for cleaving a bonded wafer structure having a first wafer and a second wafer, the first wafer having a peripheral edge including a first portion, the second wafer having a peripheral edge including a second portion, the first portion disposed opposite the second portion, the apparatus comprising:
- a first arm,
- a first clamp mounted on the first arm, the first clamp having a surface for contacting the first portion of the peripheral edge of the first wafer;
- a second arm, and
- a second clamp mounted on the second arm, the first clamp having a surface for contacting the second portion of the peripheral edge of the second wafer.
A method of cleaving a bonded wafer structure comprising a first wafer and a second wafer, the first wafer having a peripheral edge including a first portion, the second wafer having a peripheral edge including a second portion, the first portion disposed opposite the second portion, the method comprising:
- contacting the first portion of the peripheral edge of the first wafer with a surface of a first clamp mounted on a first arm;
- contacting the second portion of the peripheral edge of the second wafer with a surface of a second clamp mounted on a second arm;
- and
- cleaving the bonded wafer structure by at least one of (1) applying an upward force on the first wafer by actuating the first clamp upward or (2) applying a downward force on the second wafer by actuating the second clamp downward.
Dependencies are inferred from the claim text.