Heat dissipation structure and synthesizing method thereof
AssigneesHuawei Technologies Co., Ltd., Waseda University
InventorsSuguru NODA, Nuri NA, Mizuhisa NIHEI
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Abstract
A heat dissipation structure and a synthesizing method thereof are provided by the present disclosure. The method comprises: providing a metal foil; forming a deposition substrate on a first surface of the metal foil, wherein the deposition substrate includes a barrier layer disposed on the metal foil and a catalyst layer disposed on the barrier layer, such that catalyst in the catalyst layer is prevented from diffusing into the metal foil; and synthesizing a carbon nanotube array on the deposition substrate formed on the first surface. The method provided by the present disclosure can increase density of the CNTs in the heat dissipation structure.
Claims26
A method for synthesizing a heat dissipation structure, comprising:
- providing a metal foil;
- forming a deposition substrate on a first surface of the metal foil, wherein the deposition substrate comprises a barrier layer disposed on the metal foil and a catalyst layer disposed on the barrier layer, such that catalyst in the catalyst layer is prevented from diffusing into the metal foil;
- and
- synthesizing a carbon nanotube array on the deposition substrate formed on the first surface.
A heat dissipation structure, comprising:
- a metal foil;
- a deposition substrate disposed on a first surface of the metal foil, wherein the deposition substrate comprises a barrier layer disposed on the metal foil and a catalyst layer disposed on the barrier layer, such that catalyst in the catalyst layer is prevented from diffusing into the metal foil;
- and
- a carbon nanotube array synthesized on the deposition substrate that is disposed on the first surface.
Dependencies are inferred from the claim text.