Reduced thermal transfer to peltier cooled fets

A method to reduce transfer of heat from a cooling device to a device to be cooled by the cooling device, the method comprising:

• contacting a hot side of the cooling device to a first surface of a thermally conductive structure;
• attaching a cool side of the cooling device to a ground plane of a printed circuit board, wherein the ground plane includes a patterned-region patterned with an array of holes;
• contacting one of at least one solid-region of the ground plane of the printed circuit board to a second surface of the structure, wherein the one of at least one solid-region of the ground plane surrounds an outer perimeter of the patterned-region;
• attaching the device to be cooled to circuitry on a second surface of the printed circuit board, the second surface of the printed circuit board opposing the first surface of the printed circuit board;
• reducing heat flowing from the first surface of the structure to the second surface of the structure and to the cool side of the cooling device by a reduced cross-sectional area of the patterned-region;
• and
• reducing heat flowing from the first surface of the structure to the second surface of the structure and to the device to be cooled by the reduced cross-sectional area of the patterned-region.

The method of 11, wherein contacting the hot side of the cooling device to the first surface of the thermally conductive structure comprises:

• contacting the hot side of a Peltier device to the first surface of the thermally conductive structure,
• wherein attaching the cool side of the cooling device to at least the portion of the patterned-region of the ground plane of the printed circuit board comprises:
• attaching the cool side of the Peltier device to at least the portion of the patterned-region of the ground plane of the printed circuit board,
• wherein attaching the device to be cooled to circuitry on the second surface of the printed circuit board comprises:
• attaching a field effect transistor (FET) to be cooled to a source microstrip, drain micro-strip, and a ground connection, wherein the ground connection extends through a substrate of the printed circuit board to contact the ground plane,
• the method further comprising:
• terminating electromagnetic waves propagating in the source microstrip and the drain microstrip in the array of holes patterned in the patterned-region of ground plane, wherein a pitch of the spacing is less than a quarter of wavelength of the electromagnetic wave propagating in the source microstrip and the drain microstrip.

A method of forming a printed circuit board configured to prevent heat from a cooling device from degrading performance of at least one device to be cooled, the method comprising:

• forming at least one solid-region of a ground plane on a first surface of a dielectric substrate;
• forming a patterned-region on the ground plane on the first surface of the dielectric substrate, wherein the patterned-region abruptly transitions from the at least one solid-region;
• forming circuitry on a second surface of the dielectric substrate, the second surface opposing the first surface;
• and
• forming a ground connection from the circuitry on the first surface to the second surface of the substrate.