Monolithic ltcc seal frame and lid
AssigneesHoneywell Federal Manufacturing & Technologies, LLC, Sandia Corporation
InventorsDaniel S. Krueger, Kenneth A. Peterson, Dave Stockdale, James Brent Duncan, Bristen Riggs
Life of this patent
Estimating the term…
Abstract
A method for forming a monolithic seal frame and lid for use with a substrate and electronic circuitry comprises the steps of forming a mandrel from a ceramic and glass based material, forming a seal frame and lid block from a ceramic and glass based material, creating a seal frame and lid by forming a compartment and a plurality of sidewalls in the seal frame and lid block, placing the seal frame and lid on the mandrel such that the mandrel fits within the compartment, and cofiring the seal frame and lid block.
Claims10
A microelectronic circuit package comprising:
- a substrate configured to retain one or more electronic circuits, the substrate formed from ceramic and glass material;
- and
- a seal frame and lid attached to an upper surface of the substrate, the seal frame and lid comprising:
- at least one sidewall with an inner surface and an outer surface, the inner surface defining a compartment, and
- a lid with a top surface and a bottom surface, wherein the at least one sidewall is monolithically connected to the bottom surface at the perimeter thereof and the at least one sidewall and the lid are each formed from ceramic and glass material.
A microelectronic circuit package comprising:
- a substrate configured to retain one or more electronic circuits, the substrate formed from ceramic and glass material;
- and
- a seal frame and lid attached to an upper surface of the substrate with a solder bond, the seal frame and lid comprising:
- at least one sidewall with an inner surface and an outer surface, the inner surface defining a compartment and the outer surface including a layer of metal applied thereto, and
- a lid with a top surface and a bottom surface, the bottom surface including a layer of metal applied thereto, wherein the at least one sidewall is monolithically connected to the bottom surface at the perimeter thereof and the at least one sidewall and the lid are each formed from ceramic and glass material.
A microelectronic circuit package comprising:
- a substrate configured to retain one or more electronic circuits, the substrate formed from ceramic and glass material;
- and
- a seal frame and lid attached to an upper surface of the substrate with a solder bond, the seal frame and lid comprising:
- at least one sidewall with an inner surface and an outer surface, the inner surface defining a compartment and the outer surface including a layer of metal applied thereto,
- a lid with a top surface and a bottom surface, the bottom surface including a layer of metal applied thereto, wherein the at least one sidewall is monolithically connected to the bottom surface at the perimeter thereof and the at least one sidewall and the lid are each formed from ceramic and glass material, and
- one or more divider walls positioned in the compartment, wherein the one or more divider walls are monolithically connected to the at least one sidewall and the lid.
Dependencies are inferred from the claim text.