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US 2015/0319864 A1Published application
High efficiency embedding technology
AssigneeInfineon Technologies Austria AG
InventorMartin STANDING
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Abstract
Representative implementations of devices and techniques provide improved electrical access to components, such as chip dice, for example, disposed within layers of a multi-layer printed circuit board (PCB). One or more insulating layers may be located on either side of a spacer layer containing the components. The insulating layers may have apertures strategically located to provide electrical connectivity between the components and conductive layers of the PCB.
Claims20
A method, comprising:
- forming a first dielectric film and a second dielectric film, at least one of the first and second dielectric films having one or more apertures;
- coating the first dielectric film with an adhesive, the adhesive filling any apertures in the first dielectric film;
- tacking the first dielectric film onto a first conductive sheet;
- forming a spacer having one or more apertures;
- tacking the spacer to the first dielectric film;
- bonding one or more electrical components into the one or more apertures in the spacer;
- coating the second dielectric film with the adhesive, the adhesive filling any apertures in the second dielectric film;
- tacking the second dielectric film to the dielectric spacer;
- tacking a second conductive sheet onto the second dielectric film;
- and
- laminating the first conductive sheet, the first dielectric film, the spacer, the one or more electrical components, the second dielectric film, and the second conductive sheet to form a laminated structure.
8 more elements
A multi-layer laminated printed circuit board (PCB), comprising:
- first and second conductive layers,
- first and second dielectric layers disposed between the first and second conductive layers, at least one of the first and second dielectric layers having one or more pre-formed apertures;
- a spacer layer disposed between the first and second dielectric layers, the spacer layer having one or more pre-formed apertures;
- and
- one or more electrical components disposed within the one or more pre-formed apertures of the spacer layer and electrically coupled to a portion of at least one of the first and second conductive layers via the one or more pre-formed apertures of the at least one of the first and second dielectric layers.
2 more elements
Dependencies are inferred from the claim text.