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OwnerDhananjaya Turpuseema, Thomas P. Warwick +2inventors
InventorsDhananjaya Turpuseema, Thomas P. Warwick, Thomas Smith, James V. Russell
Estimating the term…
A method and electrical interconnect structure internal to a printed circuit board for the purposes of creating a reliable, high performing connection method between embedded component terminals, signal traces and or power/ground planes which may occupy the same vertical space as the embedded components, such as a capacitor or resistor. Further easing the assembly and reliability through the manufacturing process of said embedded component structures. In one structure castellated drilled, plated vias connect the trace or plane within the printed circuit board to the electrical terminals of the embedded component using a permanent and highly conductive attach material. In another structure, the trace or plane connect by selective side-wall plating, which surrounds the electrical terminal of the component. This structure also uses a permanent and highly conductive attach material to electrically connect the component terminal to the plated side-wall and in a final embodiment the terminals are connected through a conductive attach material through a via in the z axis to a conductive pad.
A method for producing an electrical interconnect structure between a component terminal and a printed circuit board structure or subassembly, the steps comprising:
An electrical interconnect structure between a component terminal and a printed circuit board structure or subassembly, comprising:
A method for producing an electrical interconnect structure between a component terminal and a printed circuit board structure or subassembly, the steps comprising:
An electrical interconnect structure between a component terminal and a side wall of a printed circuit board or sub assembly, comprising:
A method for producing an electrical interconnect structure between a component terminal and a side wall of a single or multi-layered printed circuit board or subassembly, the steps comprising:
An electrical interconnect structure between a component terminal and a side wall of a single or multi-layered printed circuit board or subassembly, the steps comprising:
A method for producing an electrical interconnect structure between a component terminal and a side wall of a single or multi-layered printed circuit board or subassembly, the steps comprising:
An electrical interconnect structure between a component terminal and a side wall of a single or multi-layered printed circuit board or subassembly, comprising:
Dependencies are inferred from the claim text.