Back to results
US 2015/0319856 A1Published application
Epoxy resin composition, and printed circuit board using same
AssigneeLG Innotek Co., Ltd.
InventorsSungjin YUN, Jea Man PARK, Jong Heum YOON, Young Ju HAN
Life of this patent
Estimating the term…
Abstract
According to one embodiment of the present invention, an epoxy resin composition comprises an epoxy compound, a curing agent, and an inorganic filler, wherein the inorganic filler includes boron nitride (BN).
Claims13
An epoxy resin composition comprising:
- an epoxy compound represented by the following Formula 1;
- a curing agent comprising diaminodiphenyl sulfone;
- and
- an inorganic filler,
- wherein the inorganic filler comprises boron nitride (BN):
- wherein R1 to R14 may each independently be selected from the group consisting of H, Cl, Br, F, a C1-C3 alkyl, a C2-C3 alkene, and a C2-C3 alkyne, and
- m and n may each be 1, 2 or 3.
4 more elements
Dependencies are inferred from the claim text.