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US 2015/0319854 A1Published application
Epoxy resin composition and printed circuit board
AssigneeLG Innotek Co., Ltd.
InventorsMyeong Jeong KIM, Jong Heum YOON
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Abstract
The epoxy resin composition according to one embodiment of the present invention contains an epoxy compound, a curing agent, and an inorganic filler, wherein the inorganic filler contains alumina (Al2O3) and boron nitride (BN).
Claims20
An epoxy resin composition comprising:
- an epoxy compound represented by the following Formula 1;
- a curing agent comprising diaminodiphenyl sulfone;
- and
- an inorganic filler,
- wherein the inorganic filler comprises alumina (Al2O3) and boron nitride (BN):
- wherein R1 to R14 are each able to be selected from the group consisting of H, Cl, Br, F, a C1-C3 alkyl, a C2-C3 alkene, and a C2-C3 alkyne, and
- m and n are each able to be 1, 2 or 3.
4 more elements
Dependencies are inferred from the claim text.