Printed circuit board, printed circuit board strip and manufacturing method thereof
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsTae Hong MIN, Yi Hyun JUNG, Suk Hyeon CHO, Young Gwan KO
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Abstract
A printed circuit board and a manufacturing method thereof. According to one embodiment, a printed circuit board may include a core part; and a conductor pattern disposed on at least one surface of the core part, the core part includes a glass core having a side portion that is polished or thinner than a central portion of the core. According to another embodiment, a method of manufacturing the printed circuit board may include cutting a glass plate to form a glass core; and removing cracks from at least one side surface of the cut glass core.
Claims27
A printed circuit board, comprising:
- a core part that includes a glass core of which a side portion is polished;
- and
- a conductor pattern disposed on at least one surface of the core part.
A printed circuit board, comprising:
- a core part including a glass core and an insulating material enclosing the glass core, the glass core including a central portion and a protrusion portion extended from at least one side surface of the central portion, the protrusion portion being thinner than the central portion;
- and
- a conductor pattern disposed on at least one surface of the core part.
A method of manufacturing a printed circuit board including a core part and a conductor pattern disposed on at least one surface of the core part, the method comprising:
- cutting a glass plate to form a glass core;
- and
- removing cracks from at least one side surface of the cut glass core.
A printed circuit board, comprising:
- a glass core having at least one side portion that is thinner than a central portion of the core;
- an insulating part, formed on a lateral surface of the side portion and also on upper and lower surfaces of the glass core;
- and
- a conductor pattern disposed the insulating part.
Dependencies are inferred from the claim text.