Printed circuit board and method of manufacturing the same
AssigneeFanuc Corporation
InventorsNorihiro SAIDOU, Takeshi SAWADA
Life of this patent
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Abstract
A printed circuit board includes, an insulating substrate, a metal conductor which is formed on the insulating substrate, a solder resist coating a part of the metal conductor, a scooped-out portion of the metal conductor formed in the vicinity of an end of the solder resist, and a metal layer coating the scooped-out portion.
Claims2
A printed circuit board provided with an insulating substrate, a metal conductor formed on the insulating substrate, and a solder resist coating a part of the metal conductor, the printed circuit board comprising:
- a scooped-out portion of the metal conductor, formed in a region facing to an end of the solder resist;
- and
- a metal layer coating the scooped-out portion.
A method of manufacturing a printed circuit board provided with an insulating substrate, a metal conductor formed on the insulating substrate, and a solder resist coating a part of the metal conductor, comprising:
- a first step of forming a scooped-out portion formed in a region facing to an end of the solder resist in the metal conductor, and
- a second step of coating the scooped-out portion with a metal layer.
Dependencies are inferred from the claim text.