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US 2015/0319850 A1Published application
Board Integrated Interconnect
AssigneeLockheed Martin Corporation
InventorTim Gruhl
Life of this patent
Estimating the term…
Abstract
In an embodiment, a method includes forming a printed circuit board by depositing a first plurality of layers and forming an interconnect integral to the printed circuit board by depositing a second plurality of layers on at least a portion of the first plurality of layers. The interconnect includes a stabilizing structure and a contact positioned within the stabilizing structure. The stabilizing structure includes a first material and the contact includes a second material that is different than the first material.
Claims20
An apparatus, comprising:
- a printed circuit board comprising a first plurality of layers formed using a three-dimensional printing process;
- and
- an interconnect integral to the printed circuit board, the interconnect recessed within the printed circuit board and comprising:
- a second plurality of layers on at least a portion of the first plurality of layers, the second plurality of layers formed using the three-dimensional printing process;
- a stabilizing structure;
- and
- a contact positioned within the stabilizing structure;
- wherein:
- the stabilizing structure comprises a first material that is non-conductive and the contact comprises a second material that is different than the first material;
- the contact comprises an electrical contact;
- and
- the interconnect comprises a component connector.
9 more elements
A method, comprising:
- forming a printed circuit board by depositing a first plurality of layers;
- and
- forming an interconnect integral to the printed circuit board by depositing a second plurality of layers on at least a portion of the first plurality of layers, the interconnect comprising a stabilizing structure and a contact positioned within the stabilizing structure, the stabilizing structure being made of a first material and the contact being made of a second material that is different than the first material.
An apparatus, comprising:
- a printed circuit board comprising a first plurality of layers;
- and
- an interconnect integral to the printed circuit board, the interconnect comprising a second plurality of layers on at least a portion of the first plurality of layers, a stabilizing structure, and a contact positioned within the stabilizing structure, the stabilizing structure being made of a first material and the contact being made of a second material that is different than the first material.
Dependencies are inferred from the claim text.