Printed wiring board and printed circuit board

A printed wiring board comprising:

• a first outer layer;
• a second outer layer on the opposite side of the first outer layer;
• a first inner layer arranged between the first outer layer and the second outer layer;
• a second inner layer that is arranged between the first outer layer and the second outer layer and is positioned closer to the second outer layer than the first inner layer, wherein
• the first outer layer, the second outer layer, the first inner layer and the second inner layer are laminated with insulating layers disposed therebetween;
• a first main wire, wherein
• the first main wire has a plurality of first inner layer wiring patterns which are provided so as to have an electrode pad formed on the first outer layer for mounting a transmitting element thereon as a starting end, and alternate between the first inner layer and the second inner layer, toward a termination, and has a plurality of first via conductors between the inner layers, which connect the first inner layer wiring patterns provided on different layers to each other;
• a plurality of first branch wires that are sequentially branched from the starting end toward the termination of the first main wire, wherein
• Out of the plurality of the first branch wires, a first branch wire which is the closest to the starting end of the first main wire comprises a leading wire that is formed on the first outer layer and a first via conductor between the outer layer and the inner layer, and connects an electrode pad formed on the first outer layer for mounting receiving elements thereon, with the first inner layer wiring patterns formed on the first inner layer;
• a second main wire, wherein
• the second main wire has a plurality of second inner layer wiring patterns which are provided so as to have an electrode pad formed on the first outer layer for mounting a transmitting element thereon as a starting end, and alternate between the first inner layer and the second inner layer, toward a termination, and has a plurality of second via conductors between the inner layers, which connect the second inner layer wiring patterns provided on the different layers to each other;
• and
• a plurality of second branch wires which are sequentially branched from the starting end toward the termination of the second main wire, wherein Out of the plurality of the second branch wires, a second branch wire which is the closest to the starting end of the second main wire comprises a leading wire that is formed on the first outer layer and a second via conductor between the outer layer and the inner layer, and connects an electrode pad formed on the first outer layer for mounting receiving elements thereon, with the second inner layer wiring patterns formed on the first inner layer.

A printed wiring board comprising:

• a first outer layer;
• a second outer layer on the opposite side of the first outer layer;
• a first inner layer arranged between the first outer layer and the second outer layer;
• a second inner layer that is arranged between the first outer layer and the second outer layer and is positioned closer to the second outer layer than the first inner layer, wherein
• the first outer layer, the second outer layer, the first inner layer and the second inner layer are laminated with insulating layers disposed therebetween;
• a first main wire, wherein
• the first main wire has a plurality of first inner layer wiring patterns which are provided so as to have an electrode pad formed on the first outer layer for mounting a transmitting element thereon as a starting end, and alternate between the first inner layer and the second inner layer, toward a termination, and has a plurality of first via conductors between the inner layers, which connect the first inner layer wiring patterns provided on different layers to each other;
• a plurality of first branch wires that are sequentially branched from the starting end toward the termination of the first main wire, wherein
• the first branch wires comprise:
• branch wires which respectively comprise leading wires that are formed on the first outer layer and first via conductors between the outer layer and the inner layer, and which connect electrode pads formed on the first outer layer for mounting receiving elements thereon, with the first inner layer wiring patterns formed on the first inner layer;
• and
• branch wires which respectively comprise leading wires that are formed on the second outer layer and third via conductors between the outer layer and the inner layer, and which connect electrode pads formed on the second outer layer for mounting receiving elements thereon, with the first inner layer wiring patterns formed on the second inner layer;
• a second main wire, wherein
• the second main wire has a plurality of second inner layer wiring patterns which are provided so as to have an electrode pad formed on the first outer layer for mounting a transmitting element thereon as a starting end, and alternate between the first inner layer and the second inner layer, toward a termination, and has a plurality of second via conductors between the inner layers, which connect the second inner layer wiring patterns provided on different layers to each other;
• and
• a plurality of second branch wires which are sequentially branched from the starting end toward the termination of the second main wire, wherein
• the second branch wires comprise:
• branch wires which respectively comprise leading wires that are formed on the first outer layer and second via conductors between the outer layer and the inner layer, and which connect electrode pads formed on the first outer layer for mounting receiving elements thereon, with the second inner layer wiring patterns formed on the first inner layer;
• and
• branch wires which respectively comprise leading wires that are formed on the second outer layer and fourth via conductors between the outer layer and the inner layer, and which connect electrode pads formed on the second outer layer for mounting receiving elements thereon, with the second inner layer wiring patterns formed on the second inner layer.

A printed circuit board comprising:

• a transmitting element;
• a plurality of receiving elements;
• and
• a printed wiring board on which the transmitting element and the plurality of the receiving elements are mounted, wherein
• the printed wiring board comprises:
• a first outer layer;
• a second outer layer on the opposite side of the first outer layer;
• a first inner layer arranged between the first outer layer and the second outer layer;
• a second inner layer that is arranged between the first outer layer and the second outer layer and is positioned closer to the second outer layer than the first inner layer, wherein
• the first outer layer, the second outer layer, the first inner layer and the second inner layer are laminated with insulating layers disposed therebetween;
• a first main wire, wherein
• the first main wire has a plurality of first inner layer wiring patterns which are provided so as to have an electrode pad, on which the transmitting element is mounted, formed on the first outer layer, as a starting end, and alternate between the first inner layer and the second inner layer, toward a termination, and has a plurality of first via conductors between the inner layers, which connect the first inner layer wiring patterns provided on different layers to each other;
• a plurality of first branch wires that are sequentially branched from the starting end toward the termination of the first main wire, wherein
• the respective first branch wires comprise leading wires that are formed on the first outer layer, and first via conductors between the outer layer and the inner layer, and connect electrode pads, on which the receiving elements are mounted, formed on the first outer layer, with the first inner layer wiring patterns formed on the first inner layer;
• a second main wire, wherein
• the second main wire has a plurality of second inner layer wiring patterns which are provided so as to have an electrode pad, on which the transmitting element is mounted, formed on the first outer layer, as a starting end, and alternate between the first inner layer and the second inner layer, toward a termination, and has a plurality of second via conductors between the inner layers, which connect the second inner layer wiring patterns provided on the different layers to each other;
• and
• a plurality of second branch wires which are sequentially branched from the starting end toward the termination of the second main wire, wherein
• the respective second branch wires comprise leading wires that are formed on the first outer layer, and second via conductors between the outer layer and the inner layer, and connect electrode pads, on which the receiving elements are mounted, formed on the first outer layer, with the second inner layer wiring patterns formed on the first inner layer.