Memory Card Systems Comprising Flexible Integrated Circuit Element Packages, and Methods for Manufacturing Said Memory Card Systems

A method of manufacturing a memory card system, comprising:

• fixing a flexible integrated circuit device package to a lower flexible case including a material capable of being bent or folded wherein the flexible integrated circuit device package includes a material capable of being bent or folded and comprises a connection pad for an electrical connection;
• and
• combining an upper flexible case including a material capable of being bent or folded with the lower flexible case wherein the upper flexible case covers the flexible integrated circuit device package and comprises an anisotropic conductive film electrically connected to the connection pad.

A method of manufacturing a memory card system, comprising:

• fixing a flexible integrated circuit device package to an upper flexible case including a material capable of being bent or folded wherein the upper flexible case comprises an anisotropic conductive film and the flexible integrated circuit device package comprises a connection pad electrically connected to the anisotropic conductive film;
• and
• combining the upper flexible case with a lower flexible case including a material capable of being bent or folded wherein the flexible integrated circuit device package is interposed between the lower flexible case and the upper flexible case.

A method of manufacturing a flexible integrated circuit device package, comprising:

• attaching a flexible integrated circuit device to a lower substrate including a flexible material capable of being bent or folded by a transfer process wherein the flexible integrated circuit device includes a flexible material capable of being bent or folded and comprises a connection terminal for an electrical connection;
• and
• combining an upper substrate with the lower substrate wherein the upper substrate includes a flexible material capable of being bent or folded and comprises an anisotropic conductive film electrically connected to the connection terminal.