Circuit board and method for manufacturing the same

A method for manufacturing a circuit substrate, comprising:

• forming a plurality of first through holes penetrating through an insulating layer;
• forming a plurality of second through hole penetrating through the insulating layer;
• filling plating in the plurality of first through holes such that a plurality of through hole electrical conductors comprising the plating is formed through the insulating layer;
• filing plating in the second through hole such that a through hole thermal conductor comprising the plating is formed through the insulating layer;
• forming a plurality of conductor circuit layers including a first conductor circuit layer on a first surface side of the insulating layer and a second conductor circuit layer on a second surface side of the insulating layer such that the first and second conductor circuit layers are connected by the plurality of through hole electrical conductors;
• and
• forming a plurality of conductor heat transfer layers including a first conductor heat transfer layer on the first surface side of the insulating layer and a second conductor heat transfer layer on the second surface side of the insulating layer such that the first and second conductor heat transfer layers are connected by the through hole thermal conductor,
• wherein the forming of the second through hole comprises positioning the second through hole between at least two of the first through holes and forming the second through hole in a shape extending in a direction that intersects a direction connecting the at least two of the first through holes.