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US 2015/0319537 A1Published application
Electroacoustic Components and Methods Thereof
AssigneeEpcos AG
InventorsXavier PEROIS, Sylvain Jean BALLANDRAS
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Abstract
An improved electroacoustic component is provided. The component includes a carrier wafer with a passivation layer, a piezoelectric layer above the passivation layer and an interdigitated transducer in an electrode layer on the piezoelectric layer. The component is configured to work with a shear mode.
Claims43
1-41. (canceled)
An electroacoustic component comprising:
- a carrier wafer with a passivation layer;
- a piezoelectric layer disposed above the passivation layer;
- and
- an interdigitated transducer in an electrode layer disposed on the piezoelectric layer, wherein the electroacoustic component is configured to work with a shear mode.
1 more element
An electroacoustic component comprising;
- a carrier wafer with a passivation layer;
- a piezoelectric layer disposed above the passivation layer;
- an interdigitated transducer disposed in an electrode layer on the piezoelectric layer;
- and
- a Bragg minor structure disposed below the piezoelectric layer, wherein the electroacoustic component is configured to work with a higher order Lamb mode.
2 more elements
A method for manufacturing an electroacoustic component, the method comprising:
- determining optimized parameters of the electroacoustic component by:
- providing a simulation system capable of simulating the propagation of acoustic waves at an interface of a piezoelectric layer, and neglecting thermo-differential stress in at least one direction.
Dependencies are inferred from the claim text.