Stacked and tiled focal plane array
AssigneeSandia Corporation
InventorsReno Lee Sanchez, Nicolas Bikhazi, Jeffrey L. Rienstra, Randolph R. Kay, Michael L. Holmes
Life of this patent
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Abstract
Technologies pertaining to focal plane arrays (FPAs) are disclosed herein. In a general embodiment, the FPA includes a detector layer and a stack of discrete processing layers, where the stack of discrete processing layers is hybridized with the detector layer. The processing layers are each configured to perform a respective function. At least one processing layer includes multiple identical tiles, where each tile is configured to perform an identical function.
Claims20
A focal plane array (FPA) comprising:
- a detector layer formed of a photodiode material;
- a discrete analog layer that is adjacent to the detector layer and electrically coupled to the detector layer, the discrete analog layer comprises analog circuitry that is configured to receive an analog signal from the detector layer and output a processed signal that is based upon the analog signal;
- and
- a discrete digital signal processing (DSP) layer that is adjacent to the discrete analog layer and electrically coupled to the discrete analog layer, the discrete analog layer positioned between the detector layer and the discrete DSP layer, the discrete DSP layer comprises digital circuitry that is configured to receive the processed signal from the discrete analog layer and output a digital signal based upon the processed signal.
A method for forming a focal plane array (FPA) comprising:
- providing a detector layer formed of a photodiode material;
- and
- stacking a plurality of discrete processing layers to form a stack, wherein the stacking comprises communicatively contacting adjacent layers in the stack;
- and
- electrically and mechanically coupling the stack with the detector layer.
A focal plane array (FPA) comprising:
- a detector layer formed of a photodiode material;
- and
- a stack of discrete processing layers that are mechanically and electrically coupled to the detector layer, each discrete processing layer formed separately and mechanically and electrically bonded to at least one other discrete processing layer in the stack of discrete processing layers.
Dependencies are inferred from the claim text.