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US 2015/0318616 A1Published application
Antenna apparatus
AssigneeSamsung Electronics Co., Ltd.
InventorAkihiro Maruyama
Life of this patent
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Abstract
There is provided an antenna apparatus including a first wire connecting a first metal part to a fourth metal part, a second wire connecting a second metal part to a feeder, and a third wire connecting a third metal part to a fourth metal part, wherein the first, second, and third wires are arranged in parallel to one edge of a semiconductor chip, and the second wire is disposed between the first wire and the third wire.
Claims20
An antenna apparatus comprising:
- a dielectric substrate;
- a semiconductor chip mounted on the dielectric substrate;
- a first metal part, a second metal part, and third metal part each formed on the dielectric substrate;
- a feeder formed on the semiconductor chip;
- a fourth metal part formed on the semiconductor chip;
- and
- an antenna element configured to perform wireless communication in a frequency band of milliwaves, wherein the antenna element comprises a first wire connecting the first metal part to the fourth metal part, a second wire connecting the second metal part to the feeder, and a third wire connecting the third metal part to the fourth metal part, wherein the first wire, the second wire, and the third wire are each arranged in parallel to an edge of the semiconductor chip, and wherein the second wire is positioned between the first wire and the third wire.
4 more elements
Dependencies are inferred from the claim text.