Multi-layer substrate and method of manufacturing multi-layer substrate
AssigneeMando Corporation
InventorsJong Gyu PARK, Han Yeol YU
Life of this patent
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Abstract
The present invention relates to a multi-layer substrate which can be used in a wireless signal transmission/reception apparatus, etc, a through-hole and a first waveguide and a second waveguide which are formed by conductive films enclosing the inner surface of the through-hole are formed on an upper substrate and a lower substrate of the multi-layer substrate, respectively, and an RF signal can be transmitted between an upper surface and a lower surface through the two waveguides. A process of manufacturing a multi-layer substrate by a Surface Mount Technology (SMT) is used, so that a waveguide passing through the multi-layer substrate can be precisely and easily formed.
Claims15
A multi-layer substrate comprising:
- an upper substrate comprising a first substrate base, a first signal line formed on the first substrate base, and a first waveguide which is connected to the first signal line and comprises a first conductive film formed on an inner surface of a first through-hole passing through the first substrate base in a thickness direction;
- a lower substrate comprising a second base substrate, a second signal line formed on the second substrate base, and a second waveguide which is connected to the second signal line and comprises a second conductive film formed on an inner surface of a second through-hole passing through the second substrate base in a thickness direction;
- and
- a coupling layer for coupling the upper substrate and the lower substrate to each other,
- wherein a Radio Frequency (RF) signal is transmitted between the upper substrate and the lower substrate through the first waveguide and the second waveguide.
A method of manufacturing a multi-layer substrate, the method comprising:
- forming an upper substrate comprising a first signal line and a first waveguide connected to the first signal line;
- forming a lower substrate comprising a second signal line and a second waveguide connected to the second signal line;
- and
- coupling the upper substrate and the lower substrate by interposing a soldering member made of a metal material between the upper substrate and the lower substrate in a state in which the first waveguide and the second waveguide are arranged.
Dependencies are inferred from the claim text.