Light emitting diode package
AssigneeSeoul Semiconductor Co., Ltd.
InventorBang Hyun KIM
Life of this patent
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Abstract
A light emitting diode (LED) package includes an LED chip, a first lead frame and a second lead frame electrically connected to the LED chip and separated by a space, and a housing disposed on the first lead frame and the second lead frame. The housing includes an external housing surrounding a cavity, the cavity exposing a first portion of the first lead frame and a first portion of the second lead frame, and an internal housing disposed in the space, the internal housing covering a top portion of the first lead frame and a top portion of the second lead frame.
Claims20
A light emitting diode (LED) package, comprising:
- at least one LED chip;
- a first lead frame and a second lead frame electrically connected to the at least one LED chip and separated by a space;
- and
- a housing disposed on the first lead frame and the second lead frame, the housing comprising:
- an external housing surrounding a cavity, the cavity exposing a first portion of the first lead frame and a first portion of the second lead frame;
- and
- an internal housing disposed within the cavity, the internal housing comprising a first bridge extending from inner side surfaces of the external housing to intersect the space.
A light emitting diode (LED) package, comprising:
- at least one LED chip;
- a first lead frame and a second lead frame electrically connected to the at least one LED chip and separated by a space;
- and
- a housing disposed on the first lead frame and the second lead frame, the housing comprising:
- an external housing surrounding a cavity, the cavity exposing a first portion of the first lead frame and a first portion of the second lead frame;
- and
- an internal housing disposed within the cavity, the internal housing dividing the first portion of at least one of the first lead frame and the second lead frame into two portions.
Dependencies are inferred from the claim text.