Package method and package
AssigneeGenesis Photonics Inc.
InventorsChin-Hua Hung, Hao-Chung Lee, Yu-Feng Lin
Life of this patent
Estimating the term…
Abstract
A package method includes steps of providing a light emitting module, a mold and a molding compound, wherein the light emitting module includes a substrate and at least one light emitting unit disposed on the substrate, the mold has at least one recess, and a side wall of the recess is parallel to a side surface of the light emitting unit; filling the recess with the molding compound; placing the substrate on the mold reversely, so that the light emitting unit is immersed into the recess and the molding compound directly encapsulates the light emitting unit; and heating and pressing the substrate and the mold, so as to solidify the molding compound.
Claims15
A package method comprising:
- providing a light emitting module, a mold and a molding compound, wherein the light emitting module comprises a substrate and at least one light emitting unit disposed on the substrate, the mold has at least one recess, and a side wall of the recess is parallel to a side surface of the light emitting unit;
- filling the recess with the molding compound;
- placing the substrate on the mold reversely, so that the light emitting unit is immersed into the recess and the molding compound directly encapsulates the light emitting unit;
- and
- heating and pressing the substrate and the mold, so as to solidify the molding compound.
A package comprising:
- a substrate;
- a light emitting unit disposed on the substrate, the light emitting unit having a main light emitting surface;
- and
- a molding compound disposed on the substrate and directly encapsulating the light emitting unit, the molding compound comprising a plurality of first phosphor particles and a plurality of second phosphor particles, an emission wavelength of the first phosphor particles being smaller than an emission wavelength of the second phosphor particles, the first phosphor particles in the molding compound having a first concentration per unit volume, the second phosphor particles in the molding compound having a second concentration per unit volume, the first concentration per unit volume being larger than the second concentration per unit volume at a position away from the main light emitting surface, the first concentration per unit volume being smaller than the second concentration per unit volume at a position close to the main light emitting surface.
Dependencies are inferred from the claim text.