A hermetically sealed optoelectronic component
AssigneeLumichip Limited
InventorsJuha Rantala, Pekka Katila
Life of this patent
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Abstract
This invention provides inexpensively hermetically packaged optoelectronic chips. Multiple similar or dissimilar optoelectronic chips can be produced according to the present methods. Additionally, the chips may include a heat sink for efficient thermal management and elements for wavelength conversion without compromising their efficiency or quality. Furthermore, optical structures are provided to allow optimization of optical performance.
Claims43
An optoelectronic component comprising;
- a substrate,
- at least one light emitter component mounted on the substrate,
- a spacer, affixed to a first surface of the substrate and surrounding the light emitter component, said spacer having a height greater than the light emitter component, and
- a transparent covering affixed to the spacer opposite the substrate.
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A method of manufacturing an optoelectronic component comprising the steps of;
- attaching at least one light emitter component to the substrate,
- dispensing a spacer material on top of the substrate surrounding the at least one light emitter component,
- mounting a transparent covering on the spacer, and
- hermetically sealing the spacer to the transparent covering and substrate by thermally treating the composition in order to form a bonding between at least the spacer and the transparent covering at a temperature below which would damage the at least one light emitter component.
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Dependencies are inferred from the claim text.