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US 2015/0318420 A1Published application
Bonds for solar cell metallization
AssigneesSunPower Corporation, Total Marketing Services
InventorsRichard Hamilton Sewell, Michel Arsène Olivier Ngamo Toko, Matthieu Moors, Jens Dirk Moschner
Life of this patent
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Abstract
A solar cell can include a substrate and a semiconductor region disposed in or above the substrate. The solar cell can also include a conductive contact disposed on the semiconductor region with the conductive contact including a conductive foil bonded to the semiconductor region.
Claims22
A solar cell, comprising:
- a substrate;
- a semiconductor region disposed in or above the substrate;
- and
- a conductive foil thermally compressed to the semiconductor region.
1 more element
4-6. (canceled)
A method of fabricating a solar cell, the method comprising:
- placing a conductive foil over a semiconductor region disposed in or above a substrate;
- heating the conductive foil;
- applying mechanical force to the heated conductive foil to form a conductive bond for the solar cell.
(canceled)
A method of fabricating a solar cell, the method comprising:
- forming a first metal region over a semiconductor region disposed in or above a substrate;
- placing a conductive foil over the first metal region;
- bonding the conductive foil to the first metal region;
- and
- patterning the conductive foil and the first metal region.
2 more elements
Dependencies are inferred from the claim text.