Wafer-Level Bonding Method For Camera Fabrication
AssigneeOmniVision Technologies, Inc.
InventorsAlan Martin, Edward Nabighian
Life of this patent
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Abstract
A wafer-level method for fabricating a plurality of cameras includes modifying an image sensor wafer to reduce risk of the image sensor wafer warping, and bonding the image sensor wafer to a lens wafer to form a composite wafer that includes the plurality of cameras. A wafer-level method for fabricating a plurality of cameras includes bonding an image sensor wafer to a lens wafer, using a pressure sensitive adhesive, to form a composite wafer that includes the plurality of cameras.
Claims21
A wafer-level method for fabricating a plurality of cameras, comprising:
- modifying an image sensor wafer to reduce risk of the image sensor wafer warping;
- and
- bonding the image sensor wafer to a lens wafer to form a composite wafer that includes the plurality of cameras.
A wafer-level method for fabricating a plurality of cameras, comprising:
- bonding an image sensor wafer to a lens wafer, using a pressure sensitive adhesive, to form a composite wafer that includes the plurality of cameras.
Dependencies are inferred from the claim text.