System And Method For Black Coating Of Camera Cubes At Wafer Level
AssigneeOmniVision Technologies, Inc.
InventorsEdward Nabighian, Yi Quin, Ward Zhang, Alan Martin
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Abstract
A method for black coating camera cubes at wafer level includes expanding the gap between individual diced camera cubes of the wafer by stretching tape securing the diced camera cubes. The method includes applying a black coating layer to the stretched camera cubes, laser trimming undesired portions of the black coating layer, and removing the undesired portions of the black coating layer.
Claims17
A method for black coating camera cubes at wafer level, the method comprising:
- stretching a first tape attached to a wafer of camera cubes to increase a gap between individual camera cubes;
- applying a layer of black coating material to the wafer of the camera cubes;
- laser trimming a pattern within the layer of black coating, the pattern defining undesired portions of the black coating material to be removed;
- lifting off the undesired portions of the black coating material from the wafer prior to singulating each individual camera cube from the wafer.
A method for increasing a gap between individual camera cubes on a single wafer of a plurality of camera cubes, the method comprising:
- stretching, in a first direction, a first tape attached to the wafer of camera cubes to increase the gap to a first distance;
- applying ultraviolet (UV) light to the first tape;
- attaching a second tape to the wafer of camera cubes on an opposing side of the wafer opposite of the first tape;
- removing the first tape;
- and
- stretching the second tape to increase the gap a second distance.
(canceled)
Dependencies are inferred from the claim text.