Imaging circuitry with robust scribe line structures
AssigneeSemiconductor Components Industries, LLC
InventorsSwarnal Borthakur, Marc Sulfridge, Mitchell J. Mooney
Life of this patent
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Abstract
An image sensor wafer may be stacked on top of a digital signal processor (DSP) wafer. The image sensor wafer may include multiple image sensor dies, whereas the DSP wafer may include multiple DSP dies. The stacked wafers may be cut along scribe line regions to dice the wafers into individual components. Each image sensor die may include through-oxide vias (TOVs) that extend at least partially into a corresponding DSP die. Scribe line support structures may be formed surrounding the scribe line regions. The scribe line support structures and the TOVs may be formed during the same processing step. The TOVs can also be formed through deep trench isolation structures.
Claims20
A method of manufacturing imaging circuitry, comprising:
- stacking an image sensor wafer on a digital signal processor wafer;
- forming a through-oxide via in the image sensor wafer, wherein the through-oxide via extends at least partly into the digital signal processor wafer;
- and
- forming scribe line support structures at the same time as the through-oxide via.
Imaging circuitry, comprising:
- a signal processor die;
- and
- an image sensor die stacked on the signal processor die, wherein the image sensor die comprises:
- a substrate layer;
- a deep trench isolation structure formed in the substrate layer;
- and
- a through-oxide via that is formed through the deep trench isolation structure and that extends at least partly into the signal processor die.
A system, comprising:
- a signal processing unit;
- memory;
- a lens;
- input-output circuitry;
- and
- an imaging device that is stacked on the signal processing unit, wherein the imaging device comprises:
- a substrate having a front surface and a back surface;
- a plurality of imaging pixels formed in the front surface of the substrate;
- through-oxide via (TOV) structures formed through the substrate, wherein the through-oxide via extends at least partially into the signal processing unit;
- and
- scribe line support structures that are formed along a scribe line region and that are also formed through the substrate.
Dependencies are inferred from the claim text.