Method of Forming Wafer-Level Molded Structure for Package Assembly
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsTsung-Ding Wang, Bo-I Lee, Chien-Hsun Lee
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Abstract
A method of forming an integrated circuit structure is provided. In an embodiment, the method includes bonding top dies onto a bottom wafer and then molding a first molding material onto and in between the top dies and the bottom wafer. The bottom wafer, the top dies, and the first molding material are sawed to form molding units. Each of the molding units includes one of the top dies and a bottom die sawed from the bottom wafer. The molding units are bonded onto a package substrate and a second molding material is molding onto the one of the molding units and the package substrate. Thereafter, the package substrate and the second molding material are sawed to form package-molded units.
Claims20
A method of forming an integrated circuit structure, the method comprising:
- bonding a top die onto a bottom die;
- forming a first molding material onto and between the top die and the bottom die, the first molding material in contact with edges of the top die and having edges vertically aligned with respective edges of the bottom die;
- and
- bonding a package substrate to the bottom die.
A method of forming an integrated circuit structure, the method comprising:
- bonding a top die onto a bottom die;
- forming a first molding material on the bottom die, the first molding material extending along sidewalls of the top die;
- bonding the bottom die to a package substrate;
- and
- forming a second molding material over the package substrate, the second molding material extending along sidewalls of the bottom die.
A method of forming an integrated circuit structure, the method comprising:
- bonding a top die onto a bottom die of a wafer;
- forming a first molding material along sidewalls of the top die;
- singulating the bottom die from the wafer;
- bonding the bottom die onto a packaging substrate;
- and
- singulating the packaging substrate.
Dependencies are inferred from the claim text.