Back to results
US 2015/0318268 A1Published application
Multi-chip package and method of manufacturing the same
AssigneeSamsung Electronics Co., Ltd.
InventorsJUNG-SEOK AHN, SANG-WON KIM, YOUNG-SANG CHO, KWANG-CHUL CHOI, SUNG-EUN PYO
Life of this patent
Estimating the term…
Abstract
A multi-chip package includes a first semiconductor chip and a second semiconductor chip. The first semiconductor chip has a first active surface. The second semiconductor chip has a second active surface facing the first active surface. The second active surface is electrically connected with the first active surface and the first active surface of the first semiconductor chip and the second active surface of the second semiconductor chip are bonded to each other without an adhesive.
Claims5
A multi-chip package comprising:
- a first semiconductor chip having a first active surface;
- a second semiconductor chip having a second active surface, wherein the second active surface faces the first active surface and is electrically connected with the first active surface, and wherein the first active surface of the first semiconductor chip and the second active surface of the second semiconductor chip are bonded to each other;
- a first stack bump disposed on the first active surface;
- a second stack bump disposed on the second active surface, and wherein the second stack bump electrically makes contact with the first stack bump;
- and
- an underfilling layer disposed between the first active surface and the second active surface.
3 more elements
Dependencies are inferred from the claim text.