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US 2015/0318264 A1Published application
Stacked Dies With Wire Bonds and Method
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChen-Hua Yu, Ming-Fa Chen, Sung-Feng Yeh, Meng-Tse Chen, Hui-Min Huang, Hsiu-Jen Lin, Ming-Da Cheng, Chung-Shi Liu
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Abstract
Semiconductor dies are bonded to each other and electrically connected to each other. An encapsulant is utilized to protect the semiconductor dies and external connections are formed to connect the semiconductor dies within the encapsulant. In an embodiment the external connections may comprise conductive pillars, conductive reflowable material, or combinations of such.
Claims20
A semiconductor device comprising:
- a first die;
- a second die attached to the first die;
- a third die attached to the second die and located on an opposite side of the second die than the first die;
- wire bonds electrically connecting the third die to the first die;
- an encapsulant encapsulating the second die and the third die and in physical contact with a first surface of the first die;
- and
- first external connections extending into the encapsulant and in electrical connection with the third die.
4 more elements
A semiconductor device comprising:
- a first die over a second die, the first die being electrically connected to the second die;
- a third die over the first die, the third die electrically connected to the second die;
- first external connections connected to the third die;
- an encapsulant protecting the first die and the third die, wherein the first external connections extend away from the encapsulant;
- and
- a wire bond embedded within the encapsulant, wherein the wire bond electrically connects the third die to the second die.
3 more elements
A semiconductor device comprising:
- a first die, wherein the first die further comprises:
- a semiconductor substrate;
- and
- through substrate vias extending through the semiconductor substrate;
- a second die attached to the first die, wherein the second die has a smaller width than the first die;
- wire bonds electrically connecting the first die and the second die, wherein the wire bonds are electrically connected to the through substrate vias;
- and
- an encapsulant encapsulating the first die and in physical contact with a first side of the first die.
5 more elements
Dependencies are inferred from the claim text.