Method of fabricating semiconductor package, semiconductor package formed thereby, and semiconductor device including the same

A semiconductor package comprising:

• a semiconductor chip stacked on a substrate;
• an under fill resin layer filling between the semiconductor chip and the substrate and covering a side of the semiconductor chip;
• and
• a molding layer covering the under fill resin layer and a side surface of the substrate.

A method of fabricating a semiconductor package, the method comprising:

• forming trenches in a first surface of a semiconductor wafer at cutting areas between chip areas and at edge areas of the semiconductor wafer;
• stacking at least one first semiconductor chip on the first surface;
• forming an under fill resin layer to fill a gap between the first semiconductor chip and the semiconductor wafer and to cover a side of the first semiconductor chip;
• and
• forming a molding layer to cover at least a portion of the under fill resin layer and to fill at least a portion of each of the trenches.