Integrated circuit packaging system with no-reflow connection and method of manufacture thereof
OwnerKyungOe Kim, Seong Won Park +4inventors
InventorsKyungOe Kim, Seong Won Park, MinJung Kim, ChangHwan Kim, ByungHyun Kwak, WanIl Lee
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Abstract
An integrated circuit packaging system, and a method of manufacture thereof, includes: an integrated circuit; a substrate having a substrate contact; an internal interconnect between the substrate and the integrated circuit, the internal interconnect is a no-reflow connection directly on the substrate contact and the integrated circuit; and an encapsulation over the internal interconnect.
Claims20
A method of manufacture of an integrated circuit packaging system comprising:
- providing an integrated circuit;
- providing a substrate having a substrate contact;
- forming an internal interconnect between the substrate and the integrated circuit, the internal interconnect is a no-reflow connection directly on the substrate contact and the integrated circuit;
- and
- forming an encapsulation over the internal interconnect.
A method of manufacture of an integrated circuit packaging system comprising:
- providing an integrated circuit;
- providing a substrate having a substrate contact;
- forming an internal interconnect between the substrate and the integrated circuit, the internal interconnect is a no-reflow connection directly on the substrate contact and the integrated circuit;
- and
- forming an encapsulation over the internal interconnect and the substrate.
An integrated circuit packaging system comprising:
- an integrated circuit;
- a substrate having a substrate contact;
- an internal interconnect between the substrate and the integrated circuit, the internal interconnect is a no-reflow connection directly on the substrate contact and the integrated circuit;
- and
- an encapsulation over the internal interconnect.
Dependencies are inferred from the claim text.