Electroplated solder with eutectic chemical composition
AssigneeOracle International Corporation
InventorsHiren D. Thacker, John E. Cunningham
Life of this patent
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Abstract
This chip package includes a substrate having a gold (or tin) layer disposed on a surface of the substrate. The gold (or tin) layer may couple to a tin (or gold) layer disposed on a surface of a second substrate. When melted, the gold layer and the tin layer result in an interconnect with a chemical composition having a subsequent melting temperature to reflow the bump that is higher than the initial melting temperature. For example, the chemical composition may correspond to a non-equilibrium gold-tin alloy.
Claims20
A chip package, comprising:
- a first substrate having a first surface with a gold layer, wherein the gold layer is configured to couple to a tin layer disposed on a second surface of a second substrate;
- wherein, when melted at an initial melting temperature, the gold layer and the tin layer result in an interconnect with a chemical composition having a subsequent melting temperature to reflow the interconnect that is higher than the initial melting temperature
A chip package, comprising:
- a first substrate having a first surface with a tin layer, wherein the tin layer is configured to couple to a gold layer disposed on a second surface of a second substrate;
- wherein, when melted at an initial melting temperature, the gold layer and the tin layer result in an interconnect with a chemical composition having a subsequent melting temperature to reflow the interconnect that is higher than the initial melting temperature
A multi-chip module (MCM), comprising:
- a first substrate having a first surface with a first bond pad;
- a second substrate having a second surface, facing the first surface, with a second bond pad;
- and
- an interconnect electrically coupling the first bond pad and the second bond pad, wherein the interconnect has a chemical composition of gold and tin having a subsequent melting temperature to reflow the interconnect that is higher than an initial melting temperature of the interconnect.
Dependencies are inferred from the claim text.