Bonding Structures and Methods of Forming the Same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsLuan C. Tran, Yeur-Luen Tu, Ching-Chun Wang
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Abstract
A package includes a package component and a second package component. A first elongated bond pad is at a surface of the first package component, wherein the first elongated bond pad has a first length in a first longitudinal direction, and a first width smaller than the first length. A second elongated bond pad is at a surface of the second package component. The second elongated bond pad is bonded to the first elongated bond pad. The second elongated bond pad has a second length in a second longitudinal direction, and a second width smaller than the second width. The second longitudinal direction is un-parallel to the first longitudinal direction.
Claims20
A package comprising:
- a first package component comprising:
- a first bond pad at a surface of the first package component, wherein the first bond pad comprises a first middle portion, and two end portions on opposite sides of the first middle portion;
- and
- a second package component comprising:
- a second bond pad at a surface of the second package component, wherein the second bond pad is bonded to the first middle portion of the first bond pad, and the two end portions of the first bond pads are not directly bonded to the second bond pad.
A package comprising:
- a first package component comprising:
- a first dielectric layer;
- and
- a first bond pad in the first dielectric layer, wherein the first bond pad comprises a first middle portion, and two first end portions on opposite sides of the first middle portion;
- and
- a second package component comprising:
- a second dielectric layer;
- and
- a second bond pad in the second dielectric layer, wherein the second bond pad comprises a second middle portion, and two second end portions on opposite sides of the second middle portion, and wherein the first middle portion is bonded to the second middle portion, the two first end portions are in contact with the second dielectric layer, and the two second end portions are in contact with the first dielectric layer.
A package comprising:
- a first device die comprising:
- an image sensor array comprising a plurality of columns of image sensors;
- a plurality of connection lines, each connected to one of the plurality of columns;
- and
- a first plurality of bond pads, each connected to one of the plurality of connection lines, wherein the first plurality of bond pads has first lengthwise directions parallel to a first direction;
- and
- a second device die bonded to the first device die, with an interface formed between the first device die and the second device die, wherein the second device die comprises:
- a second plurality of bond pads having second lengthwise directions, wherein both the first lengthwise directions and the second lengthwise directions are parallel to the interface, and the first lengthwise directions are un-parallel to the second lengthwise directions.
Dependencies are inferred from the claim text.