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US 2015/0318240 A1Published application
Aluminum clad copper structure of an electronic component package
AssigneeFreescale Semiconductor, Inc.
InventorsBURTON J. CARPENTER, Chu-Chung Lee, Tu-Anh N. Tran
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Abstract
An electronic component package that includes a package substrate having an aluminum bond pad formed from an aluminum clad copper structure. The aluminum clad copper structure is attached to a dielectric layer. An electronic component is attached to the substrate and includes a conductive structure electrically coupled to the aluminum bond pad. The aluminum bond pad, the electronic component, and at least a portion of the substrate are encapsulated with an encapsulant.
Claims20
An electronic component package, comprising:
- a package substrate, wherein the package substrate includes:
- a dielectric layer;
- an aluminum clad copper structure attached to the dielectric layer, the aluminum clad copper structure includes an aluminum bond pad surface;
- an electronic component attached to the package substrate, the electronic component including an electrically conductive structure electrically coupled to the aluminum bond pad surface;
- an encapsulant, the encapsulant encapsulating the electronic component and at least a portion of the package substrate, wherein the encapsulant encapsulates the aluminum bond pad surface.
2 more elements
A method comprising:
- attaching an electronic component to a package substrate, the package substrate includes an aluminum clad copper structure having an aluminum bond pad surface, the aluminum clad copper structure is attached to a dielectric layer of the package substrate;
- electrically coupling a conductive structure of the electronic component to the aluminum bond pad surface;
- encapsulating the electronic component and at least a portion of the package substrate with an encapsulant, the at least a portion including the aluminum bond pad surface.
Dependencies are inferred from the claim text.