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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsJui Hsieh LAI, Ying-Hao KUO, Kuo-Chung YEE
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An apparatus includes a base portion having an upper surface and a lower surface opposite the upper surface. The apparatus also includes a first sidewall portion having a first upper portion distal the upper surface of the base portion and a first slanted sidewall between the first upper portion and the upper surface of the base portion. The apparatus further includes a second sidewall portion having a second upper portion distal the upper surface of the base portion and a second slanted sidewall between the second upper portion and the upper surface of the base portion. The first sidewall portion and the second sidewall portion define a first reservoir between the first slanted sidewall and the second slanted sidewall, the first reservoir being configured to receive a first chip package portion and to secure the first chip package portion in a first curing position.
An apparatus comprising:
A method of using an apparatus, wherein the method comprises:
A chip package comprising:
Dependencies are inferred from the claim text.