US 2015/0318236 A1 · INTEGRATED CIRCUIT PACKAGE SUBSTRATE

Abstract

Embodiments of the present disclosure are directed towards techniques and configurations for dual surface finish package substrate assemblies. In one embodiment a method includes depositing a first lamination layer on a first side of a package substrate and a first surface finish on one or more electrical contacts disposed on a second side of the package substrate; removing the first lamination layer from the first side of the package substrate; depositing a second lamination layer on the second side of the package substrate and a second surface finish on the one or more electrical contacts disposed on the first side of the package substrate; and removing the second lamination layer from the second side of the package substrate. Other embodiments may be described and/or claimed.

Claims23

Dependent claims

A method of forming an integrated circuit (IC) package substrate comprising:

depositing a first lamination layer on a first side of the package substrate and a first surface finish on one or more electrical contacts disposed on a second side of the package substrate, wherein the first side is disposed opposite the second side and the first lamination layer is to prevent deposition of the first surface finish on one or more electrical contacts disposed on the first side;
removing the first lamination layer from the first side of the package substrate to expose the one or more electrical contacts disposed on the first side;
depositing a second lamination layer on the second side of the package substrate and a second surface finish on the one or more electrical contacts disposed on the first side of the package substrate, wherein the second lamination layer is to prevent deposition of the second surface finish on the one or more electrical contacts disposed on the second side;
and
removing the second lamination layer from the second side of the package substrate.

2 more elements

Dependencies are inferred from the claim text.

Integrated circuit package substrate

Life of this patent

Integrated circuit package substrate

Life of this patent

Abstract

Claims23