Substrate, semiconductor package thereof and process of making same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsTien-Szu CHEN, Sheng-Ming WANG, Kuang-Hsiung CHEN, Yu-Ying LEE
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Abstract
A substrate, a semiconductor package thereof and a process of making the same are provided. The substrate comprises an upper circuit layer and a lower circuit layer, the upper circuit layer comprising at least one trace and at least one pad and the lower circuit layer comprising at least one trace and at least one pad, wherein the trace of the upper circuit layer and the trace of the lower circuit layer are not aligned.
Claims22
A substrate, comprising an upper circuit layer and a lower circuit layer, the upper circuit layer comprising at least one trace and at least one pad, and the lower circuit layer comprising at least one trace and at least one pad, wherein the trace of the upper circuit layer and the trace of the lower circuit layer are not aligned.
A semiconductor package, comprising:
- a substrate, the substrate comprising an upper circuit layer and a lower circuit layer, the upper circuit layer comprising at least one trace and at least one pad, and the lower circuit layer comprising at least one trace and at least one pad, wherein the trace of the upper circuit layer and the trace of the lower circuit layer are not aligned;
- and
- a die electrically connected to the upper circuit layer.
A process of making a substrate, comprising:
- providing a conductive layer, the conductive layer comprising a first surface and a second surface;
- patterning the first surface to form at least one first trace and at least one first pad;
- and
- patterning the second surface to form at least one second trace and at least one second pad.
Dependencies are inferred from the claim text.