Method and apparatus for mounting solder balls to an exposed pad or terminal of a semiconductor package

An apparatus comprising:

• a package comprising
• a die attach pad,
• a die disposed on the die attach pad, and
• a leadframe, wherein the leadframe includes an opening defined therein, wherein the opening exposes a bottom surface of the die attach pad, and wherein the leadframe comprises
• a plurality of bond pads, wherein bottom surfaces of the plurality of bond pads are exposed at a bottom surface of the leadframe,
• a plurality of traces, wherein the plurality of traces is exposed at the bottom surface of the leadframe, wherein each trace of the plurality of traces is coupled to a corresponding bond pad of the plurality of bond pads, and wherein at least some of the traces are coupled to the die at top surfaces of the at least some of traces, and
• a plurality of first insulated barriers, wherein each first insulated barrier of the plurality of first insulated barriers is located between (i) a corresponding trace and (ii) a corresponding bond pad coupled to the corresponding trace;
• and
• a substrate, wherein the package is coupled to the substrate via solder disposed on at least some of the plurality of bond pads.

A package comprising:

• a die attach pad;
• a die disposed on the die attach pad;
• and
• a leadframe, wherein the leadframe comprises
• a plurality of bond pads,
• a plurality of traces, wherein a first trace of the plurality of traces is coupled to a first bond pad of the plurality of bond pads, and wherein the first trace of the plurality of traces is coupled to the die, and
• a first insulated barrier, wherein the first insulated barrier is located between (i) the first trace of the plurality of traces and (ii) the first bond pad of the plurality of bond pads.