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US 2015/0318230 A1Published application
Flexural plate wave device for chip cooling
AssigneeBroadcom Corporation
InventorsMilind S. Bhagavat, Mehdi Saeidi, Tak Sang Yeung
Life of this patent
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Abstract
Methods, systems, and apparatuses are described for cooling electronic devices. The electrical device includes an integrated circuit die (IC) having opposing first and second surfaces, a plurality of interconnects on the second surface of the IC die that enable the IC die to be coupled to a substrate, and a flexural plate wave device. The flexural plate wave device is configured to generate a stream of air to flow across the electrical device to cool the IC die during operation of the IC die.
Claims20
An electrical device, comprising:
- an integrated circuit (IC) die having opposing first and second surfaces;
- a plurality of interconnects on the second surface of the IC die that enable the IC die to be coupled to a substrate;
- a flexural plate wave device configured to generate an acoustic wave through at least a portion of the flexural plate wave device, the acoustic wave causing vortexes of air to be pumped across the electrical device to cool the IC die during operation of the IC die.
A cooling device, comprising:
- a body that has opposing first and second surfaces;
- and
- a flexural plate wave device on the first surface that is configured to generate an acoustic wave through at least a portion of the flexural plate wave device, the acoustic wave causing vortexes of air to be pumped across the cooling device to cool an integrated circuit (IC) during operation of the integrated circuit (IC).
A method, comprising:
- operating an integrated circuit (IC) of an electrical device that generates heat during operation;
- and
- generating an acoustic wave with a flexural plate wave device of the electrical device, the acoustic wave causing vortexes of air to be pumped across the electrical device to cool the IC during operation of the IC.
Dependencies are inferred from the claim text.