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US 2015/0318229 A1Published application
Wafer level package and fan out reconstitution process for making the same
AssigneeQUALCOMM Incorporated
InventorsJianwen XU, Lizabeth Ann KESER, William STONE, Steve Joseph BEZUK, Nicholas Ka Ming YU
Life of this patent
Estimating the term…
Abstract
A wafer level package device may include a molding compound that encapsulates a substrate, a back end of line and front end of line layer on the substrate and a passivation layer of a redistribution layer without encapsulating a metal layer on the passivation layer.
Claims20
A wafer level package device comprising:
- a substrate having a non-active substrate side extending between a first substrate sidewall and a second substrate sidewall and an active substrate side extending between a third substrate sidewall and a fourth substrate sidewall;
- a redistribution layer coupled to the active substrate side, the redistribution layer having a metal layer and a dielectric layer;
- and
- a molding compound encapsulating the substrate and the metal layer being free of the molding compound.
1 more element
A wafer level package device comprising:
- a substrate having a non-active substrate side extending between a first substrate sidewall and a second substrate sidewall and an active substrate side extending between a third substrate sidewall and a fourth substrate sidewall;
- a redistribution layer coupled to the active substrate side, the redistribution layer having a metal layer and a dielectric layer;
- and
- a molding compound having a first molding compound sidewall and a second molding compound sidewall, the molding compound encapsulating the substrate while leaving the metal layer exposed such that a first width between the first molding compound sidewall and the first substrate sidewall is greater than a second width between the first molding compound sidewall and the third substrate sidewall.
1 more element
A wafer level package device comprising:
- a substrate having a non-active substrate side extending between a first substrate sidewall and a second substrate sidewall and an active substrate side extending between a third substrate sidewall and a fourth substrate sidewall;
- a redistribution layer coupled to the active substrate side, the redistribution layer having a dielectric layer in contact with the active substrate side, a polymer layer on the dielectric layer, and a metal layer in the polymer layer;
- a molding compound having a first molding compound sidewall even with the third substrate sidewall, a second molding compound sidewall even with the fourth substrate sidewall, a third molding compound sidewall extending horizontally beyond the first molding compound sidewall, and a fourth molding compound sidewall extending horizontally beyond the second molding compound sidewall;
- and
- the molding compound encapsulating the substrate such that a sixth width between the third molding compound sidewall and the first substrate sidewall is greater than a first width between the first molding compound sidewall and the first substrate sidewall.
2 more elements
Dependencies are inferred from the claim text.